EP4CE55F29C8N vs EP4CE55F29I8LN Vergleich
Detaillierter Direktvergleich von EP4CE55F29C8N von Intel und EP4CE55F29I8LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29C8N | EP4CE55F29I8LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $285,00 | $165,00 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,340 Kbits | — |
| Embedded Multiplier Blocks (18x18) | 154 | — |
| Maximum User I/O Pins | 374 | 374 |
| Logic Array Blocks (LABs) | 3,491 | 3,135 |
| Process Technology | 60 nm (TSMC low-power) | 60 nm TSMC low-power |
| Core Voltage | 1.2 V | 1.2 V |
| Gehäuse | 780-ball FBGA (F29) | 780-ball FBGA (F29) |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | 8 (commercial) | — |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| PLLs | 4 to 8 (per device) | 4 |
| Configuration Method | SRAM-based, volatile (requires external config device) | — |
| RoHS-Status | Compliant | — |
| Lead-Free / Halogen-Free | Yes (per part marking) | — |
| Device Model | — | EP4CE55 |
| Logic Elements (LEs) | — | 55,856 |
| Total Embedded Memory Bits | — | 2,396,160 bits |
| Embedded Memory (M9K blocks) | — | 260 blocks |
| 18x18 Hardware Multipliers | — | 374 |
| Ball Pitch | — | 1.0 mm |
| Betriebstemperatur | — | -40C to +85C (Industrial) |
| Lead-Free / RoHS | — | Yes (per OPN suffix N) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Supported I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |