EP4CE55F29I7N vs EP4CE55F29C6N Vergleich
Detaillierter Direktvergleich von EP4CE55F29I7N von Intel und EP4CE55F29C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29I7N | EP4CE55F29C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $154,80 | $49,95 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory Bits | 2,396,160 | — |
| Number of LABs/CLBs | 3491 | — |
| Maximum User I/O | 374 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Dedicated Clock Pins | 11 | — |
| Embedded Multipliers (18x18) | 154 | — |
| Gehäuse | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch | 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch |
| Speed Grade | I7 (industrial) | — |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C | — |
| Process Technology | 60 nm low-k | 60 nm low-power |
| RoHS-Status | Compliant | Lead-free, RoHS compliant |
| Montageart | Surface Mount | Surface Mount |
| Supply Type | Tray | — |
| Logic Elements | — | 55,856 |
| Logic Array Blocks (LABs) | — | 3491 |
| Total Memory Bits | — | 239,6160 |
| Embedded 18x18 Multipliers | — | 374 |
| Maximum Operating Frequency | — | 472.5 MHz |
| PLLs | — | 4 |
| Maximum User I/O Pins | — | [DATA_NEEDED: max user I/O count for F29 package] |
| Core Voltage | — | 1.2 V |
| I/O Voltage Support | — | 1.2 V to 3.3 V |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Configuration Methods | — | JTAG, Passive Serial (PS), Active Serial (AS) with EPCS |