EP4CE55F29I7N vs EP4CE55F29C8LN Vergleich
Detaillierter Direktvergleich von EP4CE55F29I7N von Intel und EP4CE55F29C8LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE55F29I7N | EP4CE55F29C8LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $154,80 | $78,90 |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 | — |
| Number of LABs/CLBs | 3491 | — |
| Maximum User I/O | 374 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Dedicated Clock Pins | 11 | — |
| Embedded Multipliers (18x18) | 154 | — |
| Gehäuse | 780-ball FBGA (F29), 29 mm x 29 mm, 1.0 mm pitch | 780-ball FBGA (F29), 1.0 mm pitch |
| Speed Grade | I7 (industrial) | 8 |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C | — |
| Process Technology | 60 nm low-k | 60 nm (TSMC low-power) |
| RoHS-Status | Compliant | — |
| Montageart | Surface Mount | — |
| Supply Type | Tray | — |
| Device Family | — | Cyclone IV E |
| Logic Array Blocks (LAB) | — | 3,491 |
| Embedded Memory | — | 2,396,160 bits |
| Embedded 18x18 Multipliers | — | 156 |
| Maximum User I/Os | — | 374 |
| PLLs | — | 4 |
| Global Clocks | — | 20 |
| Core Voltage | — | 1.2 V |
| Supply Voltage (VCCINT) | — | 1.0 V to 1.2 V |
| Temperature Grade | — | Commercial 0C to +85C |
| Configuration Modes | — | Active Serial, JTAG, Passive Serial |