EP4CE6E22C9L vs EP4CE10E22C8N Vergleich
Detaillierter Direktvergleich von EP4CE6E22C9L von Intel und EP4CE10E22C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6E22C9L | EP4CE10E22C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,75 | $11,10 |
| Series | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 6,272 | 10,320 |
| Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | 276,480 bits | — |
| Embedded Multipliers (18x18) | 15 | — |
| Maximum User I/O | 91 | 91 |
| User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| PLL Count | [DATA_NEEDED: PLL count] | 2 |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Gehäuse | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (E22) |
| Package Dimensions | 22 x 22 mm | — |
| Lead Pitch | 0.5 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Process Node | 60 nm | — |
| Betriebstemperatur | 0C to +85C (Commercial) | 0C to +85C |
| Speed Grade | C9 | 8 |
| RoHS-Status | Compliant | Compliant |
| Family | — | EP4CE10 |
| Embedded Memory (M9K blocks) | — | 46 |
| Embedded Memory (total) | — | 414 Kbit |
| Anzahl der Pins | — | 144 |
| Temperature Grade | — | Commercial (C) |
| Process Technology | — | 60 nm low-power |
| Configuration Mode | — | JTAG / AS / AP / PS |
| Supply Voltage (Core) | — | 1.0 V to 1.2 V |
| Lead-Free | — | Yes |