EP4CE6E22C9L vs EP4CE6E22C6N Vergleich
Detaillierter Direktvergleich von EP4CE6E22C9L von Intel und EP4CE6E22C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6E22C9L | EP4CE6E22C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,75 | $11,20 |
| Series | Cyclone IV E | — |
| Logic Elements (LE) | 6,272 | — |
| Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | 276,480 bits | — |
| Embedded Multipliers (18x18) | 15 | — |
| Maximum User I/O | 91 | — |
| User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | 10 |
| Gehäuse | 144-LQFP Exposed Pad (EQFP-144) | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) |
| Package Dimensions | 22 x 22 mm | — |
| Lead Pitch | 0.5 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Process Node | 60 nm | — |
| Betriebstemperatur | 0C to +85C (Commercial) | -40 C to +85 C (industrial, C6 speed grade) |
| Speed Grade | C9 | — |
| RoHS-Status | Compliant | Lead-Free / Compliant |
| Family | — | Cyclone IV E |
| Device | — | EP4CE6 |
| Logic Elements (LEs) | — | 6,272 |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Embedded Memory (M9K blocks) | — | [DATA_NEEDED: M9K block count] |
| Embedded Memory (Bits) | — | 270 Kbits |
| Embedded 18x18 Multipliers | — | 15 |
| PLLs | — | 2 |
| Maximum User I/Os | — | 91 |
| I/O Banks | — | 4 |
| Process Technology | — | 60 nm |
| I/O Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Configuration Modes | — | JTAG, AS (Active Serial), PS (Passive Serial) |
| Lead-Free | — | Yes |