EP4CE6E22C9LN vs EP4CE6E22C9L Vergleich
Detaillierter Direktvergleich von EP4CE6E22C9LN von Intel und EP4CE6E22C9L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6E22C9LN | EP4CE6E22C9L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,95 | $8,75 |
| Series | Cyclone® IV E | Cyclone IV E |
| Device Family | EP4CE6 (Cyclone IV E) | — |
| Logic Elements (LE) | 6,272 | 6,272 |
| Configurable Logic Blocks (CLB / LAB) | 392 | — |
| Embedded Memory (Total) | 276,480 bits | — |
| Distributed RAM | 270 Kbits | — |
| Block RAM (M9K) | 30 Kbits (M9K blocks) | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Maximum User I/O | 91 | 91 |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm | — |
| Gehäuse | 144-pin EQFP (EQFP-144, 22x22 mm, 0.5 mm pitch) | 144-LQFP Exposed Pad (EQFP-144) |
| Package Style | Exposed Pad, GULL WING leads (HLFQFP) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | [DATA_NEEDED: operating temperature grade] | 0C to +85C (Commercial) |
| RoHS-Status | Compliant (LEAD FREE per FindIC) | Compliant |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count] |
| Total RAM Bits | — | 276,480 bits |
| Embedded Multipliers (18x18) | — | 15 |
| User I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage (VCCINT) | — | 1.2 V |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| Package Dimensions | — | 22 x 22 mm |
| Lead Pitch | — | 0.5 mm |
| Process Node | — | 60 nm |
| Speed Grade | — | C9 |