EP4CE6F17C9L vs EP4CE6F17C8L Vergleich
Detaillierter Direktvergleich von EP4CE6F17C9L von Intel und EP4CE6F17C8L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6F17C9L | EP4CE6F17C8L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $15,60 | $11,10 |
| Series | Cyclone IV E | Cyclone IV E |
| Family | Cyclone IV E | — |
| Logic Elements (LE) | 6,272 | — |
| Embedded Memory Bits | 276,480 | — |
| Maximum User I/O Pins | 179 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Embedded Multipliers (18x18) | 15 | 15 |
| PLLs | 2 | 4 |
| Global Clock Networks | 10 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Betriebs-Sperrschichttemperatur | 0C to 85C (commercial) | — |
| Gehäuse | 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Process Technology | 60 nm | — |
| Configuration Mode | AS, PS, JTAG | — |
| MSL-Level | [DATA_NEEDED: MSL level] | 3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant (lead-free FBGA) | Compliant |
| Logic Elements / Cells | — | 6,272 |
| Number of CLBs | — | 392 |
| Number of Logic Elements / Cells | — | 6,272 |
| Total RAM Bits | — | 270,000 |
| Number of I/O | — | 179 max |
| Number of Gates | — | [DATA_NEEDED: gate count for EP4CE6] |
| Voltage - Supply | — | 1.0 V core, 2.5 V / 3.3 V I/O |
| Betriebstemperatur | — | 0C to +85C (commercial, L grade) |
| Speed Grade | — | C8 (commercial speed grade 8) |
| Gehäuse / Bauform | — | 256-LBGA, 17 x 17 mm, 1.0 mm pitch (F17) |
| Number of LABs/CLBs | — | 392 |
| Configuration Memory | — | External (EPCS / EPCQ serial flash) |