EP4CE75F23I7N vs EP4CE55F23I7N Vergleich
Detaillierter Direktvergleich von EP4CE75F23I7N von Intel und EP4CE55F23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F23I7N | EP4CE55F23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $118,00 | $130,40 |
| Product Line | Cyclone IV E | — |
| Family | Cyclone IV E (EP4CE) | — |
| Logic Elements (LEs) | 75,408 | — |
| Logic Array Blocks (LABs) | 4,713 | — |
| Embedded Memory Bits | 2,810,880 bits (312 M9K blocks) | — |
| Distributed RAM Bits | 200 Kbits | — |
| Embedded 18x18 Multipliers | 15 | 56 |
| PLLs | 4 | 4 |
| Global Clocks | [DATA_NEEDED: global clock network count] | — |
| Maximum User I/Os | 292 | — |
| Core Voltage (VCCINT) | 1.2 V nominal | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Process Technology | 60 nm low-power CMOS | TSMC 60 nm low-power |
| Gehäuse | 484-ball FBGA (F23, 23 mm body, 1.0 mm pitch) | 484-ball FBGA (23x23 mm, 1.0 mm pitch) |
| Operating Temperature Grade | Industrial (I7: -40C to +100C Tj) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | JTAG, AS, PS, FPP |
| External Memory Interfaces | DDR / DDR2 SDRAM, QDRII SRAM | — |
| Design Software | Quartus II / Quartus Prime | — |
| RoHS-Status | Compliant | — |
| Series | — | Cyclone IV E |
| Logic Elements | — | 55,856 |
| Configurable Logic Blocks (CLBs) | — | 3,491 |
| Embedded Memory | — | 2,396,160 bits |
| Maximum User I/O | — | 324 |
| Core Voltage | — | 1.2 V |
| Betriebstemperatur | — | -40C to +100C (industrial, I7 grade) |
| Montageart | — | Surface Mount (BGA) |
| Lead-Free / RoHS | — | Yes (lead-free finish) |
| Memory Interface Support | — | DDR, DDR2, QDRII |