EP4CE75F29I8L vs EP4CE75F29C9LN Vergleich
Detaillierter Direktvergleich von EP4CE75F29I8L von Intel und EP4CE75F29C9LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F29I8L | EP4CE75F29C9LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $203,73 | $109,50 |
| Device Family | Cyclone IV E | — |
| Logic Elements (LE) | 75,408 | 75,408 |
| Configurable Logic Blocks (CLBs) | 4,713 | — |
| Embedded Memory (bits) | 2,810,880 | — |
| Embedded 18x18 Multipliers | 274 | 200 |
| Maximum User I/O | 426 | — |
| General-Purpose PLLs | 4 | — |
| Global Clock Networks | 15 | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: VCCINT value from datasheet] |
| Internal Operating Frequency (max) | 362 MHz | — |
| Process Technology | 60 nm low power CMOS | — |
| Gehäuse | 780-ball FBGA (F29) 29x29 mm, 1.0 mm pitch | 780-FBGA (F29) |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Speed Grade | 8 | C9 |
| Configuration Memory | SRAM-based, requires external configuration device | — |
| RoHS-Status | Compliant | Compliant (Pb-free finish, "L" suffix) |
| Family | — | Cyclone IV E |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: exact LAB count for EP4CE75] |
| Total RAM Bits | — | 2,810,880 bits |
| User I/O Pins | — | 426 |
| PLLs | — | 4 |
| Ball Pitch | — | 1.0 mm |
| Temperature Grade | — | Commercial (0C to +85C) |
| Process Node | — | 60 nm (TSMC) |
| Versorgungsspannung | — | 1.2 V (per DigiChip summary) |
| Configuration Modes | — | JTAG, Active Serial, Active Parallel, Passive Serial |
| Montageart | — | Surface Mount |