EP4CGX110CF23I7N vs EP4CGX150CF23I6N Vergleich
Detaillierter Direktvergleich von EP4CGX110CF23I7N von Intel und EP4CGX150CF23I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110CF23I7N | EP4CGX150CF23I6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.650,08 | $175,80 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements | 109,424 | 149760 |
| Configurable Logic Blocks (CLBs / LABs) | 6,839 | — |
| Embedded Memory | 5,621,760 bits | 6635520 bits (6.6 Mbit) |
| User I/O Count | 270 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 60 nm | 60 nm |
| Gehäuse | FBGA-484 (484-pin FineLine BGA) | — |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Maximum Operating Frequency | 472.5 MHz | — |
| Speed Grade | I7 (industrial, balance of speed and power) | 6 |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Betriebstemperatur | -40 °C to +100 °C (industrial, inferred from 'I') | -40C to +100C (Industrial) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| User I/Os | — | 270 (per DigiKey listing) - 720 per family datasheet max |
| Anzahl der Pins | — | 484 |
| Package Type | — | FBGA (FineLine Ball Grid Array) |
| Core Voltage | — | 1.2 V |
| Transceiver Channels | — | 8 (up to 3.125 Gbps) |
| PLLs | — | 4 |
| 18x18 Multipliers | — | Up to 360 |
| Memory Blocks | — | M9K (9 Kbit each) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| RoHS-Status | — | Compliant |
| Hard IP Blocks | — | PCIe Gen1 (x1/x2/x4), memory controller |