EP4CGX110DF23I7N vs EP4CGX110CF23I7N Vergleich
Detaillierter Direktvergleich von EP4CGX110DF23I7N von Intel und EP4CGX110CF23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF23I7N | EP4CGX110CF23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $182,00 | $1.650,08 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | 5,621,760 bits |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Betriebstemperatur | -40C to +100C (industrial) | -40 °C to +100 °C (industrial, inferred from 'I') |
| Speed Grade | 7 | I7 (industrial, balance of speed and power) |
| Gehäuse | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | FBGA-484 (484-pin FineLine BGA) |
| Package Code | BGA (FBGA) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | — |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Configurable Logic Blocks (CLBs / LABs) | — | 6,839 |
| User I/O Count | — | 270 |
| Supply Voltage (Core) | — | 1.2 V |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Maximum Operating Frequency | — | 472.5 MHz |
| Lead-Free / RoHS | — | Yes (N suffix) |