EP4CGX110DF27I8N vs EP4CGX110DF31I6N Vergleich
Detaillierter Direktvergleich von EP4CGX110DF27I8N von Intel und EP4CGX110DF31I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF27I8N | EP4CGX110DF31I6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $108,90 | $108,40 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Process Technology | 60 nm low-k | 60 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Gehäuse | 672-pin FBGA (F27) | 896-BGA (FineLine BGA) |
| Embedded Memory (RAM) | 4,608 Kbits | — |
| Embedded Multipliers (18x18) | 280 | — |
| PLLs | 4 | — |
| Maximum User I/O Pins | 433 | — |
| User I/O Banks | 8 | — |
| Transceiver Channels | 8 | 8 (max) |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps | — |
| Hard IP | PCI Express Gen1 (x1/x2) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 8 | — |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory Bits | — | 5,621,760 |
| Maximum User I/Os | — | 475 |
| Embedded 18x18 Multipliers | — | 66 |
| Max Transceiver Data Rate | — | 3.125 Gbps |
| General-purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Configuration | — | SRAM-based, supports Active Serial (AS), Passive Serial (PS), JTAG |
| Hard PCIe Gen1 IP | — | Yes (x1/x4) |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |