EP4CGX110DF31C7N vs EP4CGX110DF31I6N Vergleich
Detaillierter Direktvergleich von EP4CGX110DF31C7N von Intel und EP4CGX110DF31I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF31C7N | EP4CGX110DF31I6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,40 | $108,40 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Embedded Memory (bits) | 5,621,760 | — |
| Maximum User I/O | 475 | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage (VCCINT) | 1.2 V nominal (1.16 V to 1.24 V) | — |
| PLL Analog Voltage (VCCA) | 2.5 V nominal (2.375 V to 2.625 V) | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| Hard IP Block | PCIe Gen1 x1/x2/x4 | — |
| PLLs | 4 general-purpose | — |
| Gehäuse | 896-ball FBGA (F31) | 896-BGA (FineLine BGA) |
| Speed Grade | C7 (commercial) | — |
| Operating Temperature (Commercial) | 0 °C to 85 °C (TJ) | — |
| Montageart | Surface Mount | — |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory Bits | — | 5,621,760 |
| Maximum User I/Os | — | 475 |
| Embedded 18x18 Multipliers | — | 66 |
| Transceiver Channels | — | 8 (max) |
| Max Transceiver Data Rate | — | 3.125 Gbps |
| General-purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Configuration | — | SRAM-based, supports Active Serial (AS), Passive Serial (PS), JTAG |
| Hard PCIe Gen1 IP | — | Yes (x1/x4) |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |