EP4CGX110DF31C7N vs EP4CGX150DF31C7 Vergleich
Detaillierter Direktvergleich von EP4CGX110DF31C7N von Intel und EP4CGX150DF31C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF31C7N | EP4CGX150DF31C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,40 | $218,40 |
| Family | Cyclone IV GX | — |
| Logic Elements | 109,424 | 149760 |
| Embedded Memory (bits) | 5,621,760 | — |
| Maximum User I/O | 475 | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage (VCCINT) | 1.2 V nominal (1.16 V to 1.24 V) | — |
| PLL Analog Voltage (VCCA) | 2.5 V nominal (2.375 V to 2.625 V) | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| Hard IP Block | PCIe Gen1 x1/x2/x4 | — |
| PLLs | 4 general-purpose | 4 |
| Gehäuse | 896-ball FBGA (F31) | 896-FBGA |
| Speed Grade | C7 (commercial) | C7 (commercial) |
| Operating Temperature (Commercial) | 0 °C to 85 °C (TJ) | — |
| Montageart | Surface Mount | — |
| RoHS-Status | Compliant | Compliant |
| Device Family | — | Cyclone IV GX |
| Logic Array Blocks (LABs) | — | [DATA_NEEDED: LAB count] |
| Embedded Memory (Bits) | — | 6635520 |
| Embedded Memory Blocks (M9K) | — | [DATA_NEEDED: M9K block count] |
| User I/O Pins | — | 475 |
| Transceiver Channels | — | Up to 8 |
| Transceiver Data Rate (Max) | — | 3.125 Gbps |
| 18x18 Hardware Multipliers | — | 360 |
| Global Clock Networks | — | [DATA_NEEDED: global clock count] |
| Core Voltage | — | 1.2 V |
| Pin/Package Count | — | 672 balls / 896-BGA pad pattern |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Configuration | — | JTAG / Active Serial / Passive Parallel |
| Bitstream Encryption | — | AES-256 supported |