EP4CGX150DF27C8N vs EP4CGX150DF27C8 Vergleich
Detaillierter Direktvergleich von EP4CGX150DF27C8N von Intel und EP4CGX150DF27C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP4CGX150DF27C8N - Cyclone IV GX FPGA, 149760 Cells, 672-FBGA | Intel
EP4CGX150DF27C8N ✓ Aktiv
Spezifikationsvergleich
| Parameter | EP4CGX150DF27C8N | EP4CGX150DF27C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $305,00 | $258,16 |
| Device Family | Cyclone IV GX | — |
| Series | EP4CGX150 | — |
| Logic Elements (LEs) | 149,760 | — |
| Logic Array Blocks (LABs) | 9,360 | — |
| Embedded Memory Bits | 6,635,520 | — |
| Maximum User I/O Pins | 393 | — |
| Transceivers | 8 high-speed serial channels | 8 x 3.125 Gbps |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Core Process Technology | 60 nm | — |
| Supply Voltage (Core) | 1.2 V | — |
| Betriebs-Sperrschichttemperatur | 0 C to +85 C (commercial) | — |
| Speed Grade | C8 (-8, slowest in commercial temp range) | 8 |
| Gehäuse | 672-ball FineLine BGA (FBGA), 27 x 27 mm, 1.0 mm pitch | 672-ball FBGA |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Lead Free / RoHS | Lead free, RoHS compliant | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Family | — | Cyclone IV GX |
| Logic Elements | — | 149,760 |
| Embedded Memory | — | 6,635,520 bits |
| User I/O | — | 393 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm |
| Embedded Multipliers | — | 720 (18x18) |
| PLLs | — | [DATA_NEEDED: PLL count] |
| Betriebstemperatur | — | 0C to 85C (commercial) |
| Configuration Modes | — | JTAG, Active Serial, Passive Serial |
| RoHS-Status | — | Compliant |