EP4CGX150DF31I7N vs EP4CGX110DF31I7 Vergleich
Detaillierter Direktvergleich von EP4CGX150DF31I7N von Intel und EP4CGX110DF31I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP4CGX150DF31I7N - Cyclone IV GX FPGA, 149760 LE, 8x Transceivers | Intel
EP4CGX150DF31I7N ✓ AktivSpezifikationsvergleich
| Parameter | EP4CGX150DF31I7N | EP4CGX110DF31I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $285,00 | $276,34 |
| Family | Cyclone IV GX | — |
| Logic Elements | 149760 | — |
| Logic Array Blocks (LABs) | 9360 | — |
| Embedded Memory (bits) | 6635520 | — |
| Embedded Multiplier Blocks (18x18) | 720 | — |
| User I/O | 475 | — |
| Transceivers | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) |
| PCIe Hard Controllers | 2 (Gen1) | — |
| PLLs | 4 | 4 |
| Core Supply Voltage | 1.2 V | — |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Speed Grade | I7 | -7 |
| Gehäuse | 896-ball FBGA (DF31), 31x31 mm, 1.0 mm pitch | 896-BGA (FBGA-896), 31 mm |
| Process Technology | 60 nm | — |
| RoHS-Status | Compliant (lead-free) | Compliant |
| Series | — | Cyclone IV GX |
| Device Logic Elements | — | 109,424 |
| Total Memory Bits | — | 5,621,760 |
| Number of Logic Array Blocks (LABs) | — | Not specified in provided data [DATA_NEEDED: LAB count] |
| Number of I/O | — | 475 user I/O |
| Multipliers (18x18) | — | 432 |
| M9K Memory Blocks | — | 270 |
| Ball Pitch | — | 0.8 mm |
| Temperature Grade | — | Industrial (-40C to +100C Tj) |
| Core Voltage | — | 1.2 V typical |
| Configuration Method | — | SRAM (EPCS or JTAG) |
| Montageart | — | Surface Mount |
| MSL-Level | — | 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] |