EP4CGX50CF23C7 vs EP4CGX110CF23C7 Vergleich
Detaillierter Direktvergleich von EP4CGX50CF23C7 von Intel und EP4CGX110CF23C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50CF23C7 | EP4CGX110CF23C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $55,10 | $224,84 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | — |
| Logic Cells | 49,888 | — |
| Embedded Memory Bits | 2,562,048 bits | — |
| Embedded Memory Blocks | M9K blocks, 9 Kbit each | — |
| Maximum User I/O | 290 | — |
| Gehäuse | 484-FBGA (F23) | 484-ball FineLine BGA (F23) |
| Ball Pitch | 1.0 mm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm | 60 nm low-power |
| Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C7 | — |
| Transceivers | Integrated (Cyclone IV GX) | 8 channels, up to 3.125 Gbps |
| DSP Blocks | 18x18 hardware multipliers | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (FBGA) | Surface Mount |
| Device Model | — | EP4CGX110 |
| Logic Elements (LEs) | — | 109,424 |
| Embedded Memory | — | 5,621,760 bits |
| User I/Os | — | 270 |
| Number of LABs | — | 6,839 |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 (general purpose) |
| Betriebstemperatur | — | Commercial (0C to +85C) - inferred from speed grade 'C' |
| Configuration Methods | — | JTAG, AS, PS, FPP |