EP4CGX50CF23C7 vs EP4CGX50CF23I7N Vergleich
Detaillierter Direktvergleich von EP4CGX50CF23C7 von Intel und EP4CGX50CF23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50CF23C7 | EP4CGX50CF23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $55,10 | $121,40 |
| Family | Cyclone IV GX | — |
| Logic Elements | 49,888 | — |
| Logic Cells | 49,888 | — |
| Embedded Memory Bits | 2,562,048 bits | 2,562,048 |
| Embedded Memory Blocks | M9K blocks, 9 Kbit each | — |
| Maximum User I/O | 290 | 290 |
| Gehäuse | 484-FBGA (F23) | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Ball Pitch | 1.0 mm | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C7 | — |
| Transceivers | Integrated (Cyclone IV GX) | 8 channels, up to 3.125 Gbps |
| DSP Blocks | 18x18 hardware multipliers | — |
| RoHS-Status | Compliant | Compliant (lead-free N suffix) |
| Montageart | Surface Mount (FBGA) | Surface Mount (BGA) |
| Device Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 49,888 |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Core Supply Voltage | — | 1.2 V |
| Betriebstemperatur | — | -40C to +100C (industrial, I7) |
| Configuration Modes | — | AS, PS, JTAG |
| Design Toolchain | — | Quartus II / Quartus Prime |
| Process Node | — | 60 nm (Cyclone IV family) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |