EP4CGX50DF23I7N vs EP4CGX50DF23C7N Vergleich
Detaillierter Direktvergleich von EP4CGX50DF23I7N von Intel und EP4CGX50DF23C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50DF23I7N | EP4CGX50DF23C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $105,20 | $43,20 |
| Series | Cyclone IV GX | — |
| Family | Cyclone IV | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Embedded Memory | 2,562 Kbit | — |
| Number of Logic Cells | 49,888 | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum User I/O Pins | 290 | — |
| Number of Transceivers | 8 (3.125 Gbps) | — |
| Gehäuse | 484-ball FBGA (BGA-484) | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.00 mm | — |
| Operating Temperature (Industrial) | -40 C to +100 C | — |
| Speed Grade | I7 | — |
| Number of PLLs | 4 | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant (Pb-free variant) |
| Logic Elements | — | 49,888 |
| Total RAM Bits | — | 2,432 Kbit (≈ 304 KB) |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 2 |
| Global Clock Networks | — | 8 (with up to 16 clock pins per region) |
| Number of I/O Pins | — | 290 |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Betriebstemperatur | — | 0 °C to 85 °C (commercial) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| Supported Memory Interfaces | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| MSL-Level | — | 3 (168 hours) |