EP4CGX50DF27C6N vs EP4CGX50DF27I6N Vergleich
Detaillierter Direktvergleich von EP4CGX50DF27C6N von Intel und EP4CGX50DF27I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP4CGX50DF27I6N - Cyclone IV GX FPGA, 49.9K LEs, 672-FBGA | Intel (Altera)
EP4CGX50DF27I6N ✓ AktivSpezifikationsvergleich
| Parameter | EP4CGX50DF27C6N | EP4CGX50DF27I6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $155,00 | $52,75 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Logic Array Blocks (LAB) | 3,118 | — |
| Embedded Memory | 2,562,048 bits (~313 Kbyte) | 2,502 Kbits |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 140 | — |
| User I/O Pins | 310 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C6 (commercial) | — |
| Process Technology | 60 nm low-power | 60 nm low-power |
| Gehäuse | 672-ball FineLine BGA (FBGA) | 672-ball FBGA (F27) |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Logic Elements | — | 49,888 |
| Embedded Multipliers (18x18) | — | 113 |
| Maximum User I/O | — | 310 |
| Transceiver Channels | — | 8 |
| Transceiver Data Rate | — | up to 3.125 Gbps |
| General-purpose PLLs | — | 4 |
| Operating Temperature (Industrial grade) | — | -40C to +100C junction |
| Configuration Modes | — | AS, PS, FPP, JTAG |