EP4CGX50DF27I6N vs EP4CGX50DF27C7N Vergleich
Detaillierter Direktvergleich von EP4CGX50DF27I6N von Intel und EP4CGX50DF27C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP4CGX50DF27I6N - Cyclone IV GX FPGA, 49.9K LEs, 672-FBGA | Intel (Altera)
EP4CGX50DF27I6N ✓ AktivSpezifikationsvergleich
| Parameter | EP4CGX50DF27I6N | EP4CGX50DF27C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,75 | $58,60 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | — |
| Process Technology | 60 nm low-power | — |
| Core Voltage | 1.2 V | — |
| Embedded Memory | 2,502 Kbits | — |
| Embedded Multipliers (18x18) | 113 | — |
| Maximum User I/O | 310 | — |
| Transceiver Channels | 8 | — |
| Transceiver Data Rate | up to 3.125 Gbps | — |
| General-purpose PLLs | 4 | — |
| Gehäuse | 672-ball FBGA (F27) | 672-pin FBGA (FineLine BGA) |
| Operating Temperature (Industrial grade) | -40C to +100C junction | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LE) | — | 49,888 |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count for EP4CGX50] |
| Total Embedded Memory Bits | — | 2,562,048 |
| User I/O Pins (max) | — | 310 |
| Transceivers | — | Yes (3.125 Gbps GX channels, package-dependent) |
| Core Supply Voltage | — | 1.2 V |
| Process Node | — | 60 nm |
| Operating Temperature (Commercial 'C') | — | 0C to +85C |
| PLL Count | — | 6 |
| Hard Memory Controller | — | DDR/DDR2/DDR3/QDRII/RLDRAM PHY |
| Lead-Free | — | Yes |