EP4CGX50DF27I7 vs EP4CGX50DF27I6N Vergleich
Detaillierter Direktvergleich von EP4CGX50DF27I7 von Intel und EP4CGX50DF27I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP4CGX50DF27I6N - Cyclone IV GX FPGA, 49.9K LEs, 672-FBGA | Intel (Altera)
EP4CGX50DF27I6N ✓ AktivSpezifikationsvergleich
| Parameter | EP4CGX50DF27I7 | EP4CGX50DF27I6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $99,00 | $52,75 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 LE | 49,888 |
| Embedded Memory | 2,562,048 bits (2.44 Mbit) / 250 M9K blocks of 9 Kbit | 2,502 Kbits |
| Number of LABs/CLBs | 3,118 | — |
| Embedded 18x18 Multipliers | 56 | — |
| User I/Os | 310 | — |
| Number of Transceivers | 8 (up to 3.125 Gbps) | — |
| PCIe Hard IP | 1 Gen1 controller (x1/x2/x4) | — |
| Process Technology | 60 nm | 60 nm low-power |
| Core Supply Voltage | 1.2 V | — |
| Betriebstemperatur | -40 C to +100 C (industrial I7 grade) | — |
| Gehäuse | 672-ball FBGA (F27, 27x27 mm, 1.0 mm pitch) | 672-ball FBGA (F27) |
| Montageart | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, JTAG/AS/PS | — |
| RoHS-Status | Compliant | Compliant |
| Core Voltage | — | 1.2 V |
| Embedded Multipliers (18x18) | — | 113 |
| Maximum User I/O | — | 310 |
| Transceiver Channels | — | 8 |
| Transceiver Data Rate | — | up to 3.125 Gbps |
| General-purpose PLLs | — | 4 |
| Operating Temperature (Industrial grade) | — | -40C to +100C junction |
| Configuration Modes | — | AS, PS, FPP, JTAG |