EP4CGX75CF23C7N vs EP4CGX75DF27C7 Vergleich
Detaillierter Direktvergleich von EP4CGX75CF23C7N von Intel und EP4CGX75DF27C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX75CF23C7N | EP4CGX75DF27C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $71,20 | $86,80 |
| Series | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 73,920 | — |
| Embedded Memory (bits) | 4,257,792 | — |
| Maximum User I/O Pins | 290 | — |
| Number of Logic Array Blocks (LABs) | 4,500 | — |
| Total Transceiver Channels | 8 (up to 3.125 Gbps) | — |
| Number of PLLs | 4 | — |
| Hard Memory Controllers | 2 | — |
| Core Supply Voltage | 1.16 V to 1.24 V (nominal 1.2 V) | — |
| Betriebstemperatur | 0 °C to 85 °C (commercial) | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 484-ball BGA (F23, 23 x 23 mm) | 672-ball FBGA |
| Montageart | Surface Mount | Surface Mount |
| Process Technology | 60 nm low-power CMOS | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 73,920 |
| Configurable Logic Blocks | — | 4,620 |
| User I/O | — | 310 |
| Configuration-related Bits | — | 4,257,792 |
| Versorgungsspannung | — | 1.2 V |
| Package Body | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |