EP4CGX75CF23C8 vs EP4CGX75CF23C7 Vergleich
Detaillierter Direktvergleich von EP4CGX75CF23C8 von Intel und EP4CGX75CF23C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX75CF23C8 | EP4CGX75CF23C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $88,20 | $60,50 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | 73,920 |
| Configurable Logic Blocks (CLBs) | 4,620 | — |
| Embedded Memory | 4,257,792 bits (~4.05 Mbit) | M9K blocks |
| Maximum User I/O | 290 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 3.125 Gbps integrated |
| PCIe Hard IP Blocks | 2 (Gen1) | — |
| Gehäuse | 484-ball FBGA (F23) | 484-BGA (FBGA) |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | 1.0 mm |
| Process Technology | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | — |
| Speed Grade | 8 (commercial) | — |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial, C7 suffix) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Non-Compliant (Contains Lead per DigChip listing) |
| Number of Logic Gates | — | [DATA_NEEDED: gates] |
| Total Memory Bits | — | 4,257,792 bits |
| Number of I/O | — | 290 |
| Number of LABs/CLBs | — | 4620 |
| Package Code | — | F23 |
| Supply Voltage (Core) | — | 1.0V / 1.2V |
| Lead Free Status | — | Contains Lead (per DigChip listing) |