EP4CGX75CF23I7 vs EP4CGX75DF27C7 Vergleich
Detaillierter Direktvergleich von EP4CGX75CF23I7 von Intel und EP4CGX75DF27C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX75CF23I7 | EP4CGX75DF27C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $135,00 | $86,80 |
| Series | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 73,920 | — |
| Total Memory Bits | 4,257,792 | — |
| Number of LABs/CLBs | 4,620 | — |
| Number of Logic Elements/Cells | 73,920 | — |
| Total RAM Bits | 4,257,792 | — |
| Number of I/O | 290 | — |
| Number of Multipliers (18x18) | 290 | — |
| Voltage Supply | 1.0 V / 1.2 V / 2.5 V / 3.3 V | — |
| Core Voltage | 1.2 V | — |
| Betriebstemperatur | -40C to +100C (Industrial I7 grade) | [DATA_NEEDED: operating temperature range] |
| Montageart | Surface Mount | Surface Mount |
| Gehäuse / Bauform | 484-FBGA (FBGA-484, 23x23 mm, 1.0 mm pitch) | — |
| Process Technology | 60 nm | — |
| Transceiver Speed | 3.125 Gbps | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| MSL-Level | [DATA_NEEDED: MSL Level] | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 73,920 |
| Configurable Logic Blocks | — | 4,620 |
| User I/O | — | 310 |
| Configuration-related Bits | — | 4,257,792 |
| Versorgungsspannung | — | 1.2 V |
| Gehäuse | — | 672-ball FBGA |
| Package Body | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |