EP4CGX75DF27C7 vs EP4CGX75DF27C6 Vergleich
Detaillierter Direktvergleich von EP4CGX75DF27C7 von Intel und EP4CGX75DF27C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX75DF27C7 | EP4CGX75DF27C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $86,80 | $109,20 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Cyclone IV GX | — |
| Logic Cells | 73,920 | — |
| Configurable Logic Blocks | 4,620 | — |
| User I/O | 310 | — |
| Configuration-related Bits | 4,257,792 | — |
| Versorgungsspannung | 1.2 V | — |
| Gehäuse | 672-ball FBGA | 672-ball FBGA |
| Package Body | 27 mm x 27 mm | — |
| Ball Pitch | 1 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Terminal Form | Ball | — |
| Package Code | BGA | F27 (672-FBGA) |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Family | — | Cyclone IV GX |
| Device Logic Elements | — | 73,920 |
| Embedded Memory Bits | — | 4,257,792 |
| Maximum User I/O | — | 310 |
| Process Technology | — | 60 nm CMOS |
| Core Supply Voltage | — | 1.2 V |
| Transceivers | — | Integrated (3.125 Gbps) |
| Embedded Multipliers (18x18) | — | 274 |
| PLLs | — | Yes (periphery and global) |
| PCIe Hard IP | — | Yes (Gen1) |
| Configuration Modes | — | JTAG, Active Serial, Passive Serial |
| Operating Temperature Grade | — | Commercial |
| Speed Grade | — | 6 |