EP4CGX75DF27I6N vs EP4CGX75DF27C7N Vergleich

Detaillierter Direktvergleich von EP4CGX75DF27I6N von Intel und EP4CGX75DF27C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4CGX75DF27I6N EP4CGX75DF27C7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $65,00 $96,40
Family Cyclone IV GX Cyclone IV GX
Device Model EP4CGX75 —
Logic Elements (LE) 73,920 73,920
Logic Array Blocks (LABs) [DATA_NEEDED: LAB count] —
Embedded Memory Bits 4,257,792 —
Embedded Memory Blocks M9K (9 Kbit) —
Maximum User I/O 310 —
Transceivers Up to 8 channels —
Transceiver Data Rate Up to 3.125 Gbps —
PLLs [DATA_NEEDED: total PLL count] —
Hard PCIe Blocks x1 / x2 Gen1 —
Process Node 60 nm —
Core Voltage (VCCINT) 1.2 V —
Gehäuse FBGA-672 (FineLine BGA) 672-FBGA (27 x 27 mm, 1.0 mm pitch)
Pin / Ball Count 672 —
Operating Temperature (I6N suffix) -40C to +100C (industrial) —
Configuration Modes JTAG, Serial, Parallel —
RoHS-Status Compliant Compliant
Lead-Free Yes Yes
Series — Cyclone IV
Number of Logic Blocks / CLBs — 4620 CLBs / 47 logic blocks (reported)
Total Memory Bits — 4,257,792 bits
Number of I/O — 310
Versorgungsspannung — 1.2 V (core)
Number of Transceivers — Up to 8 (3.125 Gbps)
Montageart — Surface Mount (BGA)
Betriebstemperatur — 0C to +85C (commercial, C7 suffix)
Operating Frequency (max) — 472.5 MHz
MSL-Level — [DATA_NEEDED: MSL level]
Process Technology — 60 nm low-power
Transceiver Data Rate (max) — 3.125 Gbps
Embedded Multipliers — [DATA_NEEDED: 18 x 18 multiplier count]
Configuration Method — SRAM-based, JTAG / AS / PS modes
Design Software — Quartus II (Cyclone IV support)

Datenblätter & Ressourcen

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