EP4CGX75DF27I6N vs EP4CGX75DF27I7N Vergleich
Detaillierter Direktvergleich von EP4CGX75DF27I6N von Intel und EP4CGX75DF27I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX75DF27I6N | EP4CGX75DF27I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $65,00 | $58,75 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Model | EP4CGX75 | EP4CGX75 |
| Logic Elements (LE) | 73,920 | 73,920 |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Embedded Memory Bits | 4,257,792 | — |
| Embedded Memory Blocks | M9K (9 Kbit) | — |
| Maximum User I/O | 310 | — |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | 3.125 Gbps |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Hard PCIe Blocks | x1 / x2 Gen1 | — |
| Process Node | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Gehäuse | FBGA-672 (FineLine BGA) | FBGA-672 (27 mm) |
| Pin / Ball Count | 672 | — |
| Operating Temperature (I6N suffix) | -40C to +100C (industrial) | — |
| Configuration Modes | JTAG, Serial, Parallel | JTAG, AS, AP, PS |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Embedded Memory | — | 4,257,792 bits (M9K blocks) |
| User I/O Count | — | 310 |
| Supply Voltage - Core | — | 1.2 V |
| Betriebstemperatur | — | -40C to +100C (Industrial, I7) |
| Process Technology | — | 60 nm |
| Number of Transceivers | — | 8 channels |
| Hard PCIe Block | — | Gen1 x1/x2/x4 (PIPE) |
| Number of PLLs | — | 8 |
| Number of I/O Banks | — | 8 |