EP4S40G2F40I2NAB vs EP4CGX150DF31I7N Vergleich
Detaillierter Direktvergleich von EP4S40G2F40I2NAB von Intel und EP4CGX150DF31I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP4CGX150DF31I7N - Cyclone IV GX FPGA, 149760 LE, 8x Transceivers | Intel
EP4CGX150DF31I7N ✓ AktivSpezifikationsvergleich
| Parameter | EP4S40G2F40I2NAB | EP4CGX150DF31I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.120,00 | $285,00 |
| Family | Stratix IV GT | Cyclone IV GX |
| Logic Elements (LE) | 228,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Total Embedded Memory Bits | 17,544,192 | — |
| Embedded Memory Type | M9K + M144K blocks | — |
| User I/O Pins | 654 | — |
| Multi-Gigigabit Transceivers | 48 (Stratix IV GT, configuration-dependent) | — |
| Transceiver Data Rate | 600 Mbps to 11.3 Gbps | — |
| PLLs | 8 | 4 |
| Hard IP for PCIe | Gen1 / Gen2 endpoints | — |
| Core Voltage | 0.95 V | — |
| Process Technology | 40 nm | 60 nm |
| Gehäuse | 1517-ball FCBGA (F40) | 896-ball FBGA (DF31), 31x31 mm, 1.0 mm pitch |
| Betriebstemperatur | -40C to +100C (industrial, I2) | -40C to +100C (Industrial) |
| MSL-Level | 4 (72 hours floor life) | — |
| Montageart | Surface Mount (flip-chip BGA) | — |
| Logic Elements | — | 149760 |
| Logic Array Blocks (LABs) | — | 9360 |
| Embedded Memory (bits) | — | 6635520 |
| Embedded Multiplier Blocks (18x18) | — | 720 |
| User I/O | — | 475 |
| Transceivers | — | 8 (up to 3.125 Gbps) |
| PCIe Hard Controllers | — | 2 (Gen1) |
| Core Supply Voltage | — | 1.2 V |
| Speed Grade | — | I7 |
| RoHS-Status | — | Compliant (lead-free) |