EP4SGX230HF35I4G vs EP4SGX230DF29I3N Vergleich
Detaillierter Direktvergleich von EP4SGX230HF35I4G von Intel und EP4SGX230DF29I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX230HF35I4G | EP4SGX230DF29I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $7.900,00 | $1.480,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 228,000 | 228000 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Gehäuse | 1152-ball FCBGA (HF35) | — |
| Betriebstemperatur | -40C to +100C (Industrial) | -40C to +100C (TJ) |
| Core Voltage | 0.93 V | — |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| RoHS-Status | Compliant | Compliant (per distributor listing) |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Series | — | EP4SGX230 |
| Number of LABs/CLBs | — | 9120 |
| Number of Logic Elements/Cells | — | 228000 |
| Total RAM Bits | — | 17544192 |
| Number of I/O | — | 372 |
| Voltage - Supply | — | 0.87 V to 0.93 V |
| Gehäuse / Bauform | — | 780-BBGA, FCBGA |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |
| Programmable | — | Not Verified (per distributor listing) |
| Part Status | — | Obsolete |