EP4SGX360FF35C2XN vs EP4SGX360FF35I4N Vergleich
Detaillierter Direktvergleich von EP4SGX360FF35C2XN von Intel und EP4SGX360FF35I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FF35C2XN | EP4SGX360FF35I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.600,00 | $1.245,00 |
| Family | Stratix IV GX | — |
| Logic Elements | 353,600 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Number of I/O | 564 | 564 |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | — |
| Number of Transceivers | 24 | [DATA_NEEDED: exact transceiver count per datasheet] |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm CMOS |
| Gehäuse | 1152-BBGA, FCBGA (Flip-Chip BGA) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0C to +85C (Commercial) | -40C to +100C (Industrial, I4 grade) |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| Series | — | Stratix IV GX |
| Number of Logic Elements / Cells | — | 353,600 |
| Number of LABs / CLBs | — | 14,144 |
| Voltage - Supply | — | 0.9 V core |
| Gehäuse / Bauform | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 x 35 mm |
| Supplier Device Package | — | FBGA-1152 |
| Lead Free / RoHS | — | Yes (Lead Free) |
| Clock Frequency (max) | — | 717 MHz |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel max Gbps per datasheet] |