EP4SGX360FF35I3 vs EP4SGX360FF35I4N Vergleich
Detaillierter Direktvergleich von EP4SGX360FF35I3 von Intel und EP4SGX360FF35I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FF35I3 | EP4SGX360FF35I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.695,00 | $1.245,00 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | — |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | [DATA_NEEDED: exact transceiver count per datasheet] |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm CMOS |
| Betriebstemperatur | -40C to +100C | -40C to +100C (Industrial, I4 grade) |
| Gehäuse | 1152-BBGA, FCBGA (Flip-Chip) | — |
| Montageart | Surface Mount | Surface Mount |
| Speed Grade | I3 | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| MSL-Level | [DATA_NEEDED: MSL] | — |
| Number of Logic Elements / Cells | — | 353,600 |
| Number of LABs / CLBs | — | 14,144 |
| Number of I/O | — | 564 |
| Voltage - Supply | — | 0.9 V core |
| Gehäuse / Bauform | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 x 35 mm |
| Supplier Device Package | — | FBGA-1152 |
| Lead Free / RoHS | — | Yes (Lead Free) |
| Clock Frequency (max) | — | 717 MHz |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel max Gbps per datasheet] |