EP4SGX360FF35I4N vs EP4SGX360FH29C4 Vergleich

Detaillierter Direktvergleich von EP4SGX360FF35I4N von Intel und EP4SGX360FH29C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4SGX360FF35I4N EP4SGX360FH29C4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.245,00 $3.225,00
Series Stratix IV GX Stratix IV GX
Number of Logic Elements / Cells 353,600 —
Number of LABs / CLBs 14,144 —
Total RAM Bits 23,105,536 —
Number of I/O 564 —
Voltage - Supply 0.9 V core —
Process Technology 40 nm CMOS —
Montageart Surface Mount Surface Mount (BGA)
Gehäuse / Bauform 1152-BBGA, FCBGA —
Package Dimensions 35 x 35 mm —
Supplier Device Package FBGA-1152 —
Betriebstemperatur -40C to +100C (Industrial, I4 grade) 0 C to +85 C (commercial, C4 grade)
Lead Free / RoHS Yes (Lead Free) —
Clock Frequency (max) 717 MHz —
Number of Transceivers [DATA_NEEDED: exact transceiver count per datasheet] —
Transceiver Data Rate [DATA_NEEDED: per-channel max Gbps per datasheet] —
Family — Stratix IV
Logic Elements — 353,600
Adaptive Logic Modules (ALMs) — 141,440
Logic Array Blocks (LABs) — 14,144
Embedded Memory (bits) — 23,105,536
DSP Blocks — [DATA_NEEDED: DSP block count]
User I/Os — 289
Transceivers — [DATA_NEEDED: number of transceivers and max data rate]
Core Voltage — 0.9 V
Process Node — 40 nm
Gehäuse — 780-ball FC-HFBGA (HBGA-780), 33 x 33 mm
RoHS-Status — Compliant
Lead-Free / Halogen-Free — [DATA_NEEDED: lead-free and halogen-free status]
MSL-Level — [DATA_NEEDED: MSL rating]
Configuration Method — JTAG / Fast Passive Parallel / Active Serial

Datenblätter & Ressourcen

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