EP4SGX360FH29C4N vs EP4SGX360FF35I4N Vergleich
Detaillierter Direktvergleich von EP4SGX360FH29C4N von Intel und EP4SGX360FF35I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FH29C4N | EP4SGX360FF35I4N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.850,00 | $1.245,00 |
| Family | Stratix IV GX | — |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total Memory Bits | 23,105,536 | — |
| Number of User I/Os | 289 | — |
| Betriebstemperatur | 0C to 85C (commercial) | -40C to +100C (Industrial, I4 grade) |
| Gehäuse | 780-FCBGA, FC-HFBGA (FH29) | — |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Voltage | 0.9 V | — |
| Speed Grade | C4 (mid-tier) | — |
| Number of Transceivers | 24 (up to 8.5 Gbps) | [DATA_NEEDED: exact transceiver count per datasheet] |
| Embedded Multipliers (18x18) | 1,288 | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 (168 Hours) | — |
| Peak Reflow Temperature | 40 s max | — |
| RoHS-Status | Compliant / Lead-free | — |
| Montageart | Surface Mount | Surface Mount |
| Series | — | Stratix IV GX |
| Number of Logic Elements / Cells | — | 353,600 |
| Number of LABs / CLBs | — | 14,144 |
| Total RAM Bits | — | 23,105,536 |
| Number of I/O | — | 564 |
| Voltage - Supply | — | 0.9 V core |
| Gehäuse / Bauform | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 x 35 mm |
| Supplier Device Package | — | FBGA-1152 |
| Lead Free / RoHS | — | Yes (Lead Free) |
| Clock Frequency (max) | — | 717 MHz |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel max Gbps per datasheet] |