EP4SGX360FH29C4N vs EP4SGX360FH29C4 Vergleich
Detaillierter Direktvergleich von EP4SGX360FH29C4N von Intel und EP4SGX360FH29C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FH29C4N | EP4SGX360FH29C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.850,00 | $3.225,00 |
| Family | Stratix IV GX | Stratix IV |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total Memory Bits | 23,105,536 | — |
| Number of User I/Os | 289 | — |
| Betriebstemperatur | 0C to 85C (commercial) | 0 C to +85 C (commercial, C4 grade) |
| Gehäuse | 780-FCBGA, FC-HFBGA (FH29) | 780-ball FC-HFBGA (HBGA-780), 33 x 33 mm |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C4 (mid-tier) | — |
| Number of Transceivers | 24 (up to 8.5 Gbps) | — |
| Embedded Multipliers (18x18) | 1,288 | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 (168 Hours) | — |
| Peak Reflow Temperature | 40 s max | — |
| RoHS-Status | Compliant / Lead-free | Compliant |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Series | — | Stratix IV GX |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | 141,440 |
| Logic Array Blocks (LABs) | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| User I/Os | — | 289 |
| Transceivers | — | [DATA_NEEDED: number of transceivers and max data rate] |
| Process Node | — | 40 nm |
| Lead-Free / Halogen-Free | — | [DATA_NEEDED: lead-free and halogen-free status] |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |
| Configuration Method | — | JTAG / Fast Passive Parallel / Active Serial |