EP4SGX360FH29C4N vs EP4SGX360FH29I3 Vergleich
Detaillierter Direktvergleich von EP4SGX360FH29C4N von Intel und EP4SGX360FH29I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FH29C4N | EP4SGX360FH29I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4.850,00 | $0,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total Memory Bits | 23,105,536 | — |
| Number of User I/Os | 289 | — |
| Betriebstemperatur | 0C to 85C (commercial) | [DATA_NEEDED: operating temperature range] |
| Gehäuse | 780-FCBGA, FC-HFBGA (FH29) | 780-pin FC-HFBGA |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | — |
| Speed Grade | C4 (mid-tier) | — |
| Number of Transceivers | 24 (up to 8.5 Gbps) | — |
| Embedded Multipliers (18x18) | 1,288 | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 (168 Hours) | — |
| Peak Reflow Temperature | 40 s max | — |
| RoHS-Status | Compliant / Lead-free | unknown |
| Montageart | Surface Mount | Surface Mount |
| Manufacturer | — | Intel / Altera |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 353600 cells |
| Embedded Memory | — | 23105536 bits |
| User I/O | — | 289 I/O |
| Core Supply Voltage | — | 0.9 V |
| Terminal Count | — | 780 balls |
| Package Form | — | Ball Grid Array (BGA) |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Maximum Transceiver Data Rate | — | [DATA_NEEDED: maximum transceiver data rate] |
| I/O Standard Support | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | not_applicable |