EP4SGX360KF40C2 vs EP4SGX360KF40C3N Vergleich
Detaillierter Direktvergleich von EP4SGX360KF40C2 von Intel und EP4SGX360KF40C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360KF40C2 | EP4SGX360KF40C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.400,00 | $1.320,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm CMOS |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | 8.5 Gbps |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | C3 |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Gehäuse | 1517-ball FCBGA, 42.5 x 42.5 mm | 1517-ball FC-FBGA (KF40) |
| Montageart | Surface Mount (flip-chip BGA) | — |
| MSL-Level | MSL3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | — |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | 141,440 |
| Logic Array Blocks (LABs) | — | 14,144 |
| Number of I/Os | — | 744 |
| Embedded Memory | — | 19.7 Mbits |
| DSP Blocks (18x18 Multipliers) | — | 1,040 |
| Transceivers | — | 24 channels |
| Lead Free / RoHS | — | Yes / Compliant |