EP4SGX360NF45C2N vs EP4SGX360HF35C2N Vergleich
Detaillierter Direktvergleich von EP4SGX360NF45C2N von Intel und EP4SGX360HF35C2N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360NF45C2N | EP4SGX360HF35C2N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11.800,00 | $3.295,00 |
| Family | Stratix IV GX | FPGA - Field Programmable Gate Array |
| Logic Elements | 353,600 | — |
| Logic Array Blocks (LABs) | 14,144 | — |
| User I/Os | 920 | — |
| Embedded Memory Bits | 23,105,536 | — |
| Embedded Memory Type | M9K + MLAB | — |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Voltage (VCCINT) | 0.9 V | — |
| Transceivers | Hard multi-gigabit transceivers up to 8.5 Gbps | — |
| PCI Express Hard IP | Gen1/Gen2 with x1/x2/x4 support | — |
| Speed Grade | -2 (commercial performance) | 35 (HF35) |
| Betriebstemperatur | 0C to 85C (commercial, N suffix in legacy Altera marking) | 0C to +85C (commercial) |
| Gehäuse | 1932-ball FC-FBGA | 1152-BBGA, FCBGA (HF35) |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount |
| MSL-Level | MSL3 (per JEDEC J-STD-020) | — |
| Lead-Free / RoHS | Yes (compliant) | — |
| Configuration | JTAG / Fast Passive Parallel / Active Serial (EPCS) | — |
| Series | — | Stratix IV GX |
| Number of Logic Elements/Cells | — | 353,600 |
| Number of LABs/CLBs | — | 14,144 |
| Number of I/O | — | 564 |
| Total RAM Bits | — | 23,105,536 |
| Core Voltage | — | 0.9 V |
| DSP Performance | — | 800 MHz |
| Lead Free | — | Yes |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |
| Power/Temperature Grade | — | C2 |
| Embedded Transceivers | — | Yes (multi-gigabit) |
| DSP Blocks | — | Yes (variable-precision) |