EP4SGX360NF45C2N vs EP4SGX360NF45I4 Vergleich
Detaillierter Direktvergleich von EP4SGX360NF45C2N von Intel und EP4SGX360NF45I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360NF45C2N | EP4SGX360NF45I4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11.800,00 | $2.350,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Logic Array Blocks (LABs) | 14,144 | 14,144 |
| User I/Os | 920 | — |
| Embedded Memory Bits | 23,105,536 | — |
| Embedded Memory Type | M9K + MLAB | — |
| Process Technology | 40 nm | TSMC 40 nm |
| Core Voltage (VCCINT) | 0.9 V | — |
| Transceivers | Hard multi-gigabit transceivers up to 8.5 Gbps | 8 channels, up to 8.5 Gbps |
| PCI Express Hard IP | Gen1/Gen2 with x1/x2/x4 support | — |
| Speed Grade | -2 (commercial performance) | -4 (I4 suffix) |
| Betriebstemperatur | 0C to 85C (commercial, N suffix in legacy Altera marking) | — |
| Gehäuse | 1932-ball FC-FBGA | 1932-ball FC-BGA (NF45), 45 mm square |
| Montageart | Surface Mount (flip-chip BGA) | Surface Mount (flip-chip BGA) |
| MSL-Level | MSL3 (per JEDEC J-STD-020) | 4 (per BGA package) |
| Lead-Free / RoHS | Yes (compliant) | — |
| Configuration | JTAG / Fast Passive Parallel / Active Serial (EPCS) | — |
| Adaptive Logic Modules (ALMs) | — | 141,440 |
| Embedded Memory | — | 23,105,536 bits (approx. 23 Mbits) |
| User I/O Pins | — | 920 |
| Maximale Taktfrequenz | — | 717 MHz |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (-40C to +100C ambient, I-suffix) |
| RoHS-Status | — | Compliant |
| Design Software | — | Quartus II / Quartus Prime |
| Device Variant | — | Standard logic - GX transceiver family |