EP4SGX530HH35C4 vs EP4SGX530HH35C4N Vergleich

Detaillierter Direktvergleich von EP4SGX530HH35C4 von Intel und EP4SGX530HH35C4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP4SGX530HH35C4N EP4SGX530HH35C4N - 531K LE Stratix IV GX FPGA | Intel | 1152-FCBGA

EP4SGX530HH35C4N - 531K LE Stratix IV GX FPGA | Intel | 1152-FCBGA

EP4SGX530HH35C4N ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP4SGX530HH35C4 EP4SGX530HH35C4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $3.120,00 $3.490,00
Series Stratix IV GX —
Device Type FPGA —
Logic Elements 531,200 531,200
Adaptive Logic Modules (ALMs) 21,248 LABs / 212,480 equivalent LEs —
Embedded Memory (bits) 28,033,024 —
Maximum User I/O Pins 564 —
Process Technology 40 nm 40 nm CMOS
Core Supply Voltage 0.9 V —
Gehäuse 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) 1152-ball FCBGA (Flip-Chip BGA)
Speed Grade HH35 C4
Betriebstemperatur 0 C to 85 C (Commercial, -C4 suffix) —
Transceivers Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] Up to 24 channels at up to 8.5 Gbps (family maximum)
DSP Blocks [DATA_NEEDED: block count for this density] —
PLLs 8 fractional PLLs —
Montageart Surface Mount (flip-chip BGA) Surface Mount (BGA)
MSL-Level MSL3 (per BGA package standard) [DATA_NEEDED: MSL level]
RoHS-Status Compliant —
Family — Stratix IV GX
Logic Array Blocks (LABs) — 21,248
Total RAM Bits — 28,033,024 (approximately 28 Mb)
User I/O Pins — 564
Core Voltage (typical) — 0.9 V
Temperature Grade — Commercial
Lead-Free / RoHS — Yes (RoHS compliant per N designator)
Lebenszyklusstatus — Last Time Buy (mature device, recommended for new designs migrating to Stratix 10 or Agilex)

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