EP4SGX530HH35I4 vs EP4SGX530HH35C4 Vergleich
Detaillierter Direktvergleich von EP4SGX530HH35I4 von Intel und EP4SGX530HH35C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX530HH35I4 | EP4SGX530HH35C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.150,00 | $3.120,00 |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Series | Stratix IV GX | Stratix IV GX |
| Logic Elements | 531,200 | 531,200 |
| Logic Array Blocks (LABs) | 21,248 | — |
| Embedded Memory (bits) | 28,033,024 | 28,033,024 |
| Maximum User I/O | 564 | — |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate | 600 Mbps to 8.5 Gbps | — |
| Maximum Internal Frequency | 800 MHz | — |
| Embedded 18x18 Multipliers | 1,040 | — |
| PLL Count | 4 | — |
| Global Clock Networks | 16 | — |
| Gehäuse | 1152-BBGA, FCBGA (HBGA-1152), 42.5 x 42.5 mm | 1152-ball FCBGA / FBGA (42.5 x 42.5 mm) |
| Ball Pitch | 1.0 mm | — |
| Betriebstemperatur | 0C to 85C (Industrial) | 0 C to 85 C (Commercial, -C4 suffix) |
| Speed Grade | I4 | HH35 |
| Process Node | 40 nm TSMC | — |
| PCI Express Hard IP | Gen1/Gen2 x1/x4/x8 | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount (flip-chip BGA) |
| Adaptive Logic Modules (ALMs) | — | 21,248 LABs / 212,480 equivalent LEs |
| Maximum User I/O Pins | — | 564 |
| Process Technology | — | 40 nm |
| Core Supply Voltage | — | 0.9 V |
| Transceivers | — | Up to 24 multi-gigabit transceivers at up to 8.5 Gbps [DATA_NEEDED: exact count for this package] |
| DSP Blocks | — | [DATA_NEEDED: block count for this density] |
| PLLs | — | 8 fractional PLLs |
| MSL-Level | — | MSL3 (per BGA package standard) |