EP4SGX530KH40C2 vs EP4SGX530KH40C3 Vergleich
Detaillierter Direktvergleich von EP4SGX530KH40C2 von Intel und EP4SGX530KH40C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX530KH40C2 | EP4SGX530KH40C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.150,00 | $8.650,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Logic Elements | 531,200 | 531,200 |
| LABs / CLBs | 21,248 | — |
| Total RAM Bits | 28,033,024 | — |
| Number of I/Os | 744 | — |
| Number of Transceivers | 48 channels | — |
| Transceiver Data Rate | Up to 8.5 Gbps per channel | Up to 8.5 Gbps |
| Internal Frequency | 800 MHz | — |
| Process Technology | 40 nm CMOS | — |
| Package Type | 1517-BBGA, FCBGA | — |
| Package Dimensions | 42.50 x 42.50 mm | — |
| Betriebstemperatur | 0 C to +85 C (commercial) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Configurable Logic Blocks (CLBs) | — | 212,480 |
| Embedded Memory (bits) | — | 28,033,024 |
| Embedded Memory (Mbits) | — | 28,033,024 / 8 ≈ 3,504 KBytes |
| Maximum User I/O | — | 744 |
| Transceivers | — | Up to 48 channels |
| Hard PCIe Gen2 Endpoint | — | Yes |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: count] |
| PLLs | — | 12 (typical) |
| Gehäuse | — | 1517-BBGA, FCBGA |
| Package Pin Count | — | 1517 balls |
| Ball Pitch | — | 1.0 mm (typical for FCBGA-1517) |
| Process Node | — | 40 nm CMOS |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Speed Grade | — | C3 |