EP4SGX70DF29I3G vs EP4SGX70DF29I4N Vergleich

Detaillierter Direktvergleich von EP4SGX70DF29I3G von Intel und EP4SGX70DF29I4N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4SGX70DF29I3G EP4SGX70DF29I4N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.080,00 $1.295,00
Series Stratix IV GX —
Process Technology 40 nm 40 nm
Logic Elements (LE) 72,600 —
Embedded Memory Bits 7,564,880 (about 7.5 Mbit) —
Embedded Memory Blocks 72600 —
Number of Logic Cells / Arrays 372 —
Number of User I/O Pins 372 —
Number of Transceiver Channels [DATA_NEEDED: exact channel count for this device] —
Transceiver Data Rate [DATA_NEEDED: per-channel data rate] —
Package Type 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) —
Package Code DF29 —
Operating Temperature Grade Industrial (I3) —
Junction Temperature Range -40C to +100C —
Core Supply Voltage 0.87 V to 0.93 V —
Speed Grade -3 I4
Montageart Surface Mount (BGA) Surface Mount
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status Compliant —
Halogenfrei [DATA_NEEDED: halogen-free claim] —
Family — Stratix IV GX
Logic Elements — 72,600
Logic Array Blocks (LABs/CLBs) — 2,904
Total RAM Bits — 7,564,880
User I/Os — 372
Core Voltage — 0.9 V
Gehäuse — 780-BBGA, FC-FBGA (DF29), 29 x 29 mm
Betriebstemperatur — -40C to +100C (industrial)
Lead-Free / RoHS — Yes (lead free per supplier listings)
Cell Count — 72,600 cells
Maximum Frequency — 717 MHz
Supplier Package Code — FBGA-780 (DF29)

Datenblätter & Ressourcen

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