EPF10K100ARC240-2 vs EPF10K100BQC240-1 Vergleich

Detaillierter Direktvergleich von EPF10K100ARC240-2 von Altera und EPF10K100BQC240-1 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Altera
EPF10K100ARC240-2 EPF10K100ARC240-2 - FLEX 10KA FPGA, 4992 LEs | Altera

EPF10K100ARC240-2 - FLEX 10KA FPGA, 4992 LEs | Altera

EPF10K100ARC240-2 Obsolete
Intel
EPF10K100BQC240-1 EPF10K100BQC240-1 - 100K FLEX-10K FPGA, 240-PQFP | Intel / Altera

EPF10K100BQC240-1 - 100K FLEX-10K FPGA, 240-PQFP | Intel / Altera

EPF10K100BQC240-1 ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EPF10K100ARC240-2 EPF10K100BQC240-1
Marke Altera Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $118,00 $119,00
Series / Family FLEX 10KA (FLEX 10K embedded PLD family) —
Device Type Field Programmable Gate Array (FPGA) —
Logic Elements (LEs) 4,992 6,144
Logic Array Blocks (LABs) 624 —
Typical Gate Count 100,000 gates —
Embedded Memory 24,576 RAM bits —
Number of User I/Os 189 —
Maximum Operating Frequency 142.86 MHz —
Propagation Delay 0.600 ns (distributor parametric listing; see validation note) —
Versorgungsspannung 3.3 V —
Logic Family CMOS —
Speed Grade -2 -1
Gehäuse / Bauform 240-pin RQFP (BFQFP) with exposed pad —
Number of Terminals 240 —
Terminal Form Gull wing —
Package Shape Square —
Montageart Surface mount Surface Mount
Betriebstemperaturbereich 0 C to +70 C (commercial grade) —
Temperature Grading Commercial —
Configuration Memory Technology [DATA_NEEDED: configuration memory technology] —
RoHS-Status [DATA_NEEDED: RoHS status of the -2 speed grade] [DATA_NEEDED: RoHS compliance]
Series — FLEX-10K
Family — FLEX-10K (EPF10K100B)
Typical Gates — 100,000
Embedded Array Blocks (EABs) — 12
Total RAM Bits — 24,576 (12 × 2,048 bits per EAB)
Maximum User I/O — 189
Supply Voltage (VCCINT / VCCIO) — 4.75 V to 5.25 V
Combinatorial tPD (typical) — 11 ns
Gehäuse — 240-pin BFQFP / PQFP (BQC suffix)
Package Dimensions — 32 mm × 32 mm
Process Technology — 0.42 µm SRAM CMOS
Betriebstemperatur — 0 °C to +70 °C (commercial)
Configuration Method — ByteBlasterMV / BitBlaster / JTAG
MSL-Level — 3 (per JEDEC J-STD-020)

Datenblätter & Ressourcen

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