EPF10K100EBC356-2X vs EPF10K100EBC356-2 Vergleich
Detaillierter Direktvergleich von EPF10K100EBC356-2X von Altera und EPF10K100EBC356-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 ObsoleteSpezifikationsvergleich
| Parameter | EPF10K100EBC356-2X | EPF10K100EBC356-2 |
|---|---|---|
| Marke | Altera | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $171,00 | $59,95 |
| Series | FLEX 10KE | FLEX-10KE |
| Manufacturer | Altera (Intel Programmable Solutions Group) | — |
| Number of Logic Elements/Cells | 4992 | — |
| Total RAM Bits | 49152 | 49,152 |
| Number of Logic Array Blocks (LABs) | 624 | — |
| Number of Gates | 100000 | — |
| Number of User I/Os | 274 | — |
| Number of Embedded Array Blocks (EABs) | 12 | — |
| Core Voltage - Supply | 2.375 V to 2.625 V | — |
| I/O Supply Voltage | 3.3 V | — |
| Propagation Delay (tpd) | 0.6 ns (typical) | — |
| Logic Family | CMOS | — |
| Betriebstemperatur | 0 °C to +70 °C (Commercial) | 0 C to 70 C (Commercial) |
| Gehäuse / Bauform | 356-LBGA (35 mm x 35 mm) | — |
| Supplier Device Package | 356-BGA | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Lead free / RoHS Compliant | [DATA_NEEDED: RoHS compliance] |
| Configuration Memory | SRAM (volatile, unlimited reconfigures) | — |
| Family | — | Embedded Programmable Logic Device (PLD) |
| Typical Gates | — | 100,000 |
| Maximum System Gates | — | 158,000 |
| Logic Elements (LEs) | — | 4,992 |
| Number of LABs/CLBs | — | 624 |
| Embedded Array Blocks (EABs) | — | 12 |
| User I/O Pins | — | 274 |
| Supply Voltage (Core) | — | 2.375 V to 2.625 V (2.5 V nominal) |
| Propagation Delay (tPD) | — | 0.5 ns |
| Internal Operating Frequency | — | up to 250 MHz |
| Process Technology | — | CMOS, SRAM-based |
| Package Type | — | 356-LBGA (35 x 35 mm, 1.27 mm pitch) |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1) |
| Speed Grade | — | -2 |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |