EPF10K100EFC484-1N vs EPF10K100EFC484-1X Vergleich
Detaillierter Direktvergleich von EPF10K100EFC484-1N von Intel und EPF10K100EFC484-1X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EPF10K100EFC484-1N - 100K FLEX 10KE FPGA, 338 I/O, 484-BGA | Intel
EPF10K100EFC484-1N ObsoleteSpezifikationsvergleich
| Parameter | EPF10K100EFC484-1N | EPF10K100EFC484-1X |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $158,00 | $349,57 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | FLEX 10KE | FLEX-10KE® |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Logic Elements / Cells | 4,992 | 4992 |
| Equivalent Gates | 100,000 | — |
| Embedded Memory Bits | 49,152 bits | — |
| Number of LABs | 624 | — |
| Number of Logic Elements | 4,992 | — |
| User I/Os | 338 | — |
| Anzahl der Pins | 356 (BGA-356 per one source) / 484 (BGA-484 per other sources) | — |
| Gehäuse | 484-BBGA (FineLine BGA) | 484-FBGA (FineLine BGA, 23 × 23 mm) |
| Montageart | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 3.3 V (5 V-tolerant inputs via VCCIO) | — |
| Propagation Delay (worst case) | 0.6 ns | — |
| Betriebstemperatur | 0 °C to 70 °C (commercial) | 0 °C to +70 °C (commercial) |
| Configuration | SRAM-based, in-system reprogrammable | — |
| JTAG / IEEE 1149.1 | Yes | — |
| RoHS-Status | compliant (lead-free FBGA) | [DATA_NEEDED: RoHS status] |
| Lebenszyklusstatus | Obsolete (NRND per Intel/Altera PCN history) | — |
| Family | — | FLEX 10KE |
| System Gates | — | 100,000 |
| Logic Array Blocks (LABs) | — | 624 |
| Total RAM Bits | — | 49,152 |
| User I/O Count | — | 338 |
| Number of I/O Pins | — | 338 (package provides up to 488 bonded I/O pads) |
| Supply Voltage (Core) | — | 2.5 V (2.375 V – 2.625 V) |
| Supply Voltage (I/O) | — | 3.3 V |
| Maximum Internal Frequency | — | 333.33 MHz |
| Propagation Delay | — | 0.6 ns (per logic element, typical) |
| Programming Interface | — | JTAG / serial (ByteBlaster-compatible) |