EPF10K100EFI256-2 vs EPF10K100EFC256-2 Vergleich

Detaillierter Direktvergleich von EPF10K100EFI256-2 von Intel und EPF10K100EFC256-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPF10K100EFI256-2 EPF10K100EFC256-2
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $92,00 $165,00
Family FLEX 10KE —
Typical Gates 100,000 —
Logic Elements / Cells 4,992 4,992 (49,152 user logic elements)
Total RAM Bits 49,152 [DATA_NEEDED: total EAB RAM bits]
Logic Array Blocks (LABs) 624 —
Embedded Array Blocks (EABs) 12 —
User I/O Pins 191 —
Gehäuse 256-Ball FineLine BGA (FBGA-256) 256-FBGA (FineLine BGA, 17 x 17 mm)
Package Body Size 17 x 17 mm —
Ball Pitch 1.0 mm —
Supply Voltage - Core 2.5 V —
Supply Voltage - I/O 3.3 V —
Maximum Toggle Frequency 250 MHz —
Propagation Delay 0.5 ns (typical) —
Process Technology 0.22 µm CMOS, 4-layer metal 0.22 µm CMOS SRAM
Betriebstemperatur 0C to +70C (commercial) 0 °C to +70 °C (Commercial)
Configuration Mode Passive Serial / JTAG —
RoHS-Status unknown [DATA_NEEDED: RoHS compliance]
Series — FLEX 10KE
Manufacturer — Intel (formerly Altera)
Number of LABs — 624
User I/Os — 191
Number of Gates — 100,000 equivalent
Core Supply Voltage (VCCINT) — 2.375 V to 2.625 V
Logic Family — CMOS (SRAM-based)
Propagation Delay (per LUT) — ~0.6 ns (speed grade -2)
Montageart — Surface Mount (BGA)
Configuration Method — PS, JTAG, in-system programmable
Embedded Array Blocks — Yes (EAB for RAM/ROM/DSP)

Datenblätter & Ressourcen

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