EPF10K100EQC240-2N vs EPF10K100EQC240-3N Vergleich
Detaillierter Direktvergleich von EPF10K100EQC240-2N von Altera und EPF10K100EQC240-3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Altera
EPF10K100EQC240-2N - 100K Gates FLEX-10KE FPGA, 240-PQFP | Altera
EPF10K100EQC240-2N Obsolete
Spezifikationsvergleich
| Parameter | EPF10K100EQC240-2N | EPF10K100EQC240-3N |
|---|---|---|
| Marke | Altera | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,40 | $49,95 |
| Series | FLEX 10KE | FLEX 10KE |
| Logic Elements / Cells | 4992 | 4,992 |
| Total RAM Bits | 49152 | 49,152 |
| Number of LABs / CLBs | 624 | — |
| Number of Gates (Typical) | 100000 | — |
| Number of I/O Pins (User I/O) | 189 | — |
| Voltage - Supply (VCCINT) | 2.375 V to 2.625 V (typ. 2.5 V) | — |
| I/O Voltage | 3.3 V multi-voltage I/O | — |
| Betriebstemperatur | 0C to +70C (Commercial, N suffix) | 0 °C to +70 °C (Commercial) |
| Montageart | Surface Mount | Surface Mount |
| Gehäuse / Bauform | 240-BQFP / 240-PQFP (32x32 mm) | — |
| Supplier Device Package | 240-PQFP (32x32) | — |
| Logic Family | CMOS, SRAM-based | — |
| Propagation Delay | 0.6 ns (typical, per datasheet support listing) | 0.6 ns |
| Configuration Method | Passive Serial / ByteBlaster; volatile SRAM (external EPC1/EPC2 PROM required) | — |
| RoHS-Status | Lead free / RoHS Compliant | — |
| Lebenszyklusstatus | Obsolete (discontinued by Altera/Intel) | — |
| Family | — | FLEX 10KE (Embedded Programmable Logic Device) |
| Total System Gates | — | 100,000 (typical) |
| Logic Array Blocks (LABs) | — | 624 |
| Embedded Array Blocks (EABs) | — | 16 |
| Maximum User I/Os | — | 189 |
| Number of PLLs | — | 4 |
| Maximum Internal Frequency | — | 200 MHz |
| Core Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 3.3 V (5 V tolerant with PCI clamping) |
| Process Technology | — | 0.22 µm CMOS |
| Package Type | — | 240-pin BFQFP (Power Quad Flat Pack) |
| JTAG Support | — | IEEE Std. 1149.1 boundary-scan |
| Lead-Free / RoHS | — | Pb-free matte tin (N suffix) |
| Configuration Memory Companion | — | EPC2LC20N or compatible |