EPF10K130EFC484-3 vs EPF10K100EFC484-3 Vergleich
Detaillierter Direktvergleich von EPF10K130EFC484-3 von Intel und EPF10K100EFC484-3 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K130EFC484-3 | EPF10K100EFC484-3 |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $178,92 | $65,00 |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements (LEs) | 6,656 | — |
| Typical Gate Count | 130,000 system gates | — |
| Logic Array Blocks (LABs) | 832 | 624 |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | — |
| Maximum User I/O | 369 | — |
| Supply Voltage (Core) | 3.3 V | — |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | — |
| Propagation Delay | 0.6 ns (per LE) | — |
| Speed Grade | -3 | -3 (fastest commercial) |
| Betriebstemperatur | 0 C to +70 C (commercial) | 0C to +70C (Commercial) |
| Gehäuse | 484-pin FBGA (FineLine BGA) | 484-ball FineLine BGA |
| Montageart | Surface Mount (BGA) | — |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | SRAM (volatile, requires configuration device) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based) | — |
| Typical Gates | — | 100,000 |
| Maximum System Gates | — | 158,000 |
| Logic Elements | — | 4,992 |
| Embedded Memory (EAB RAM) | — | 49,152 bits |
| User I/O Pins | — | 338 |
| Core Voltage | — | 2.5 V |
| I/O Standards Supported | — | 2.5V / 3.3V / 5.0V (PCI-compliant) |
| JTAG Support | — | IEEE Std. 1149.1-1990 BST |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |