EPF10K130EFC672-2X vs EPF10K200EFC672-2 Vergleich
Detaillierter Direktvergleich von EPF10K130EFC672-2X von Intel und EPF10K200EFC672-2 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPF10K130EFC672-2X | EPF10K200EFC672-2 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $92,00 | $210,00 |
| Series | FLEX 10KE | — |
| Number of Logic Elements (LEs) | 6656 | — |
| Number of Logic Array Blocks (LABs) | 832 | — |
| Total RAM Bits | 65536 | — |
| Number of User I/Os | 413 | — |
| Number of DLLs | 4 | — |
| Gehäuse | 672-FBGA (FineLine BGA, 27x27 mm) | 672-BBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | 1.27 mm |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (MultiVolt I/O supports 5.0 V, 3.3 V, 2.5 V) | — |
| Betriebstemperatur | 0C to +70C (commercial) | 0 C to 70 C |
| Process Technology | 0.22 μm CMOS SRAM | 0.22 um CMOS |
| Configuration Method | Serial configuration device, JTAG | — |
| Logic Family | CMOS, SRAM-based | CMOS |
| Montageart | Surface Mount (BGA) | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant (per distributor listing) |
| Family | — | FLEX 10KE |
| Logic Elements | — | 9,984 |
| Typical Gates | — | 200,000 |
| Maximum User I/Os | — | 470 |
| Embedded Memory | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 |
| Logic Array Blocks (LABs) | — | 624 |
| Package Dimensions | — | 45 x 45 mm |
| Speed Grade | — | -2 |
| Propagation Delay | — | 0.4 ns |
| Supply Voltage (Core) | — | [DATA_NEEDED: core Vcc] |
| Programmability | — | JTAG (IEEE 1149.1) / in-system |